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| The Effect of the Epoxy Composites Constituents on Its Thermal Behavior as An Interface Material |
Mohammed A. Akraa, Mohammed Jawad H. Kadhim, Ali S. Hasan
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Abstract:
The importance of the electronic devices imposes a challenge of finding the ways heat squandering and then to create field of research for thermal handling. The thermal material which is used as an interface must show the demanded contribution in the dispersion of heat to improve the electronic devices. Among lots of different selective materials, epoxy resin has an excellent feature qualifies it to preside the proposed materials as thermal interface. The past literatures showed the incorporated fillers of conductive materials to raise the thermal conductivity of epoxy composites. Consequently the electronic devices acquire high thermal conductivity. This work discussed the topic of the thermal properties of the interface materials, and especially epoxy as thermal interface and the role of involved fillers with high thermal conductivity in its resin.
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