Title: Enhancing Heat Flow Efficiency through Robotic Arm Assisted Soldering Iron Tip
Authors: UMAR ADAM ISAH, SADO-ALIMIKHENA ELIZABETH, ISICHEI PIUS, SHAIBU ZULKIFINU BAKO
Volume: 9
Issue: 3
Pages: 15-17
Publication Date: 2025/03/28
Abstract:
This paper introduces an innovative approach to address the intricate task of soldering electronic components by unveiling a pioneering robotic system integrated with an advanced control feedback mechanism. Through the emulation of soldering patterns, the end effector of the robotic arm intricately guides the assembly process, with a specific focus on through-hole elements on printed circuit boards (PCBs). Notably, the system implements a novel error attenuation technique to ensure precise soldering, thereby reducing errors and enhancing operational efficiency. Additionally, the heat control mechanism, guided by the arm's mimicry, carefully regulates solder iron movements, effectively addressing potential issues arising from excess solder film and safeguarding miniature heating voltages. This research marks a significant advancement in automated assembly processes, offering the promise of streamlined operations and heightened quality control in electronic manufacturing.